Reballing Stencil Template BGA134/BGA200/BGA/BGA60/BGA168/BGA178/BGA136 for iPhone CPU motherboard soldering repair.

Features:

1. High quality tin reballing steel mesh.
2. Special design: Ultra-thin steel net, easy to use.
3. BGA reballing stencil for iPhone CPU motherboard soldering repair.
4. Inspiration comes from the actual experience of mobile phone repair engineer, make a good repair tool belonging to mobile phone repair master.